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PLDA’s PCI Express 3.0 IP passes the PCI-SIG rigorous testing process, ensuring ease-of-integration and first-pass silicon success for its global customer base.

SAN JOSE, Calif. (September 10, 2013) — PLDA, the industry leader in PCI Express® and interface IP solutions today announced that its XpressRICH3™ PCI Express® (PCIe®) 3.0 solution, passed all Gold and Interoperability tests performed by the PCI-SIG® committee during its most recent workshop in August 2013. The testing was conducted using the PLDA XpressRICH3 IP, running in an add-in card configuration on PLDA’s Xpress V7LP board, based on a Xilinx Virtex®-7 FPGA.

SAN JOSE, USA - AIX-EN-PROVENCE, France (May 31, 2013) — PLDA, the industry leader in PCI Express® and interface IP solutions and IP-Maker today announced a joint solution integrating PLDA’s XpressRICH3 PCIe 3.0 with IP-Maker’s NVM Express (NVMe) IP cores. Cloud computing, video broadcast and high performance computing applications require high bandwith and low latency storage devices such as PCIe SSDs, enabled by the combination of speed and performance provided by PCIe 3.0 and NVMe protocol.

PLDA, the industry leader in PCI Express® and high-speed interface IP, today announced it will be debuting a live PCIe® x8 Gen3 demo featuring PLDA’s leading PCIe Gen3 soft IP core and running on a Xilinx Kintex-7 FPGA during the DAC Conference, June 3 -7 in San Francisco, CA. The PLDA PCIe Gen3 IP core is the first to run on a -2 medium speed grade Xilinx Kintex-7 FPGA while consuming only a fraction of available device resources, allowing unmatched design flexibility.

“PLDA has become known as a go-to partner for PCIe and reliable high-speed interface IP solutions, consistently pushing the design envelope for our customers”.

New half-height board delivers PCIe 3.0 x8, 40G Ethernet and DDR3 SDRAM interfaces in a complete design kit, enabling quick time-to-design

PLDA, the industry leader in PCI Express(R) and high-speed interface IP today announced incorporation of its PCIe-AXI bridge IP into Microsemi Corporation's recently announced SmartFusion(R)2 SoC FPGA. Microsemi's SmartFusion2 SoC FPGAs are the only devices that address fundamental requirements for advanced security, high reliability and low power in a wide range of critical applications. SmartFusion2 integrates an inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM(R) Cortex(TM)-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM, and industry-required high-performance communication interfaces all on a single chip.