• Bulletproofing PCIe-based SoCs with Advanced Reliability, Availability, Serviceability (RAS) Mechanisms

    1. Introduction

    As silicon manufacturing process nodes keep shrinking and transistors get smaller, System-on-Chip (SoC) are increasingly subject to failures due to changing external conditions such as temperature, EMI, power surges, Hot Plug events, etc.

    The transition to PCIe 4.0 and 5.0 with increasing PCIe signaling speeds (16GT/s and 32GT/s) also augments the risk of errors due to tightening timing budgets inside the SoC and electrical issues outside the SoC (e.g. crosstalk, line attenuation, jitter, etc.).

    Read More shauradou, 12.12.2018 | Posted in
    Technical Article
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  • Brite Semiconductor, Naneng Microelectronics, and PLDA Collaborate to Release Complete PCIe 2.0/3.0 Solution

    Shanghai, China—Dec 11, 2018

    Brite Semiconductor (“Brite”), a world-leading ASIC design service and DDR controller/PHY IP provider headquartered in Shanghai, China, today announced their collaboration with Naneng Microelectronics and PLDA to deliver a complete PCIe 2.0/3.0 solution based on SMIC’s 40nm and 55nm process technology.

    Guosheng Wu, CEO of Naneng Microelectronics, said, “Collaboration between Naneng and Brite can effectively reduce the risks and costs of SoC design by providing a low power consumption and small-area PCIe-2.0/3.0 solution based on SMIC’s 40nm and 55nm process, that meets the latest PIPE specifications and supports 2.5G and 5G data rate. We are looking forward to working with Brite to provide customers with a global solution that offers high performance and low cost, while complying with the relevant standards.”

    Read More aambrosino_22406, 12.10.2018 | Posted in
    News
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