Come & meet us at TSMC Symposium Shanghai 2019

 

TSMC SYMPOSIUM CHINA 2019 - Tuesday, June 18
Shanghai International Convention Center (SICC)

Come and meet the PLDA Team at TSMC Symposium in Shanghai !

This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at Xilinx WW Sales Conference Partner Night

 

Xilinx Worldwide Sales Conference Partner Night - Tuesday, June 4
Westin Bonaventure Hotel, Los Angeles, California

Come and meet the PLDA Team at Xilinx WW Sales Conference Partner Night in LA !

This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Enabling Composable Platforms with On-Chip PCIe Switching, PCIe-over-Cable

1. Introduction

Modern enterprise workloads in AI and data analytics are driving the need for new compute and storage architectures in IT infrastructures. The growing use of accelerators (GPUs, FPGAs, custom ASICs) and emerging memory technologies (3D XPoint, Storage Class Memory, Persistent Memory), and the need to better distribute and utilize these resources are fueling the transition to composable/disaggregated infrastructures (CDI) in data centers.

Come and meet PLDA at Chipex 2019

 

ChipEx 2019 - Monday, May 13
Tel Aviv, Israel

Come and meet the PLDA Team at Chipex in Tel Aviv!

This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at TSMC Symposium Austin 2019

 

TSMC SYMPOSIUM NA 2019 - Wednesday, May 8
Fairmont Austin

Come and meet the PLDA Team at TSMC Symposium North America in Austin!


This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at TSMC Symposium Boston 2019

 

TSMC SYMPOSIUM NA 2019 - Wednesday, May 1
Boston Mariott Burlington 

Come and meet the PLDA Team at TSMC Symposium North America in Boston!


This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at TSMC Symposium Santa Clara 2019

 

TSMC SYMPOSIUM NA 2019 - Tuesday, April 23
Santa Clara Convention Center

Come and meet the PLDA Team at TSMC Symposium North America show in Santa Clara!


This free event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

PCIe 5.0 vs. Emerging Protocol Standards - Will PCIe 5.0 Become Ubiquitous in Tomorrow’s SoCs?

1. Introduction

Over the last 3 years, a number of protocol standards have emerged, aiming to address the growing demand for higher data throughput and more efficient data movement. While CCIX, Gen-Z, and OpenCAPI are relative newcomers, PCIe has been around for almost 2 decades. With the imminent release of version 5.0 of the PCIe Specification, SoC designers have a variety of options for supporting bandwidths in excess of 400 Gbit/s while improving overall communication efficiency.

In this article, we look into the various protocols by providing a brief history, a quick technical comparison, and the latest deployment status. We also offer our perspective on the evolution of these protocols.

Video description of vDMA-AXI IP

The explosion in data traffic due to the advent of Artificial Intelligence, machine learning, automotive and IoT prompts for new System-on-Chip architectures that allow system developers to build high-performance applications that are able to ingest and process huge amounts of heterogeneous data.

 

 

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