Come and meet PLDA at Chipex 2019

 

CHIPEX 2019 - Monday, May 13
Tel Aviv, Israel

Come and meet the PLDA Team at Chipex in Tel Aviv!


This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Register at Chipex: http://chipex.co.il/?CategoryID=217 

Let's discuss your projects and issues on the Booth G85-G87

We will be happy to introduce our products and share our knowledge.

Come & meet us at TSMC Symposium Austin 2019

 

TSMC SYMPOSIUM NA 2019 - Wednesday, May 8
Fairmont Austin

Come and meet the PLDA Team at TSMC Symposium North America in Austin!


This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at TSMC Symposium Boston 2019

 

TSMC SYMPOSIUM NA 2019 - Wednesday, May 1
Boston Mariott Burlington 

Come and meet the PLDA Team at TSMC Symposium North America in Boston!


This event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

Come & meet us at TSMC Symposium Santa Clara 2019

 

TSMC SYMPOSIUM NA 2019 - Tuesday, April 23
Santa Clara Convention Center

Come and meet the PLDA Team at TSMC Symposium North America show in Santa Clara!


This free event provides a great opportunity for you to discover PLDA's latest High Speed Interconnect solutions, such as :

PCIe 5.0 vs. Emerging Protocol Standards - Will PCIe 5.0 Become Ubiquitous in Tomorrow’s SoCs?

1. Introduction

Over the last 3 years, a number of protocol standards have emerged, aiming to address the growing demand for higher data throughput and more efficient data movement. While CCIX, Gen-Z, and OpenCAPI are relative newcomers, PCIe has been around for almost 2 decades. With the imminent release of version 5.0 of the PCIe Specification, SoC designers have a variety of options for supporting bandwidths in excess of 400 Gbit/s while improving overall communication efficiency.

In this article, we look into the various protocols by providing a brief history, a quick technical comparison, and the latest deployment status. We also offer our perspective on the evolution of these protocols.

Video description of vDMA-AXI IP

The explosion in data traffic due to the advent of Artificial Intelligence, machine learning, automotive and IoT prompts for new System-on-Chip architectures that allow system developers to build high-performance applications that are able to ingest and process huge amounts of heterogeneous data.

 

 

Bulletproofing PCIe-based SoCs with Advanced Reliability, Availability, Serviceability (RAS) Mechanisms

1. Introduction

As silicon manufacturing process nodes keep shrinking and transistors get smaller, System-on-Chip (SoC) are increasingly subject to failures due to changing external conditions such as temperature, EMI, power surges, Hot Plug events, etc.

The transition to PCIe 4.0 and 5.0 with increasing PCIe signaling speeds (16GT/s and 32GT/s) also augments the risk of errors due to tightening timing budgets inside the SoC and electrical issues outside the SoC (e.g. crosstalk, line attenuation, jitter, etc.).

Brite Semiconductor, Naneng Microelectronics, and PLDA Collaborate to Release Complete PCIe 2.0/3.0 Solution

Shanghai, China—Dec 11, 2018

Brite Semiconductor (“Brite”), a world-leading ASIC design service and DDR controller/PHY IP provider headquartered in Shanghai, China, today announced their collaboration with Naneng Microelectronics and PLDA to deliver a complete PCIe 2.0/3.0 solution based on SMIC’s 40nm and 55nm process technology.

Guosheng Wu, CEO of Naneng Microelectronics, said, “Collaboration between Naneng and Brite can effectively reduce the risks and costs of SoC design by providing a low power consumption and small-area PCIe-2.0/3.0 solution based on SMIC’s 40nm and 55nm process, that meets the latest PIPE specifications and supports 2.5G and 5G data rate. We are looking forward to working with Brite to provide customers with a global solution that offers high performance and low cost, while complying with the relevant standards.”

PLDA and Samtec Demonstrate PCIe 4.0 Communication over Twinax Cables Allowing Full 16GT/s PCIe 4.0 Bandwidth at Minimal Manufacturing Cost

PLDA, the industry leader in PCI Express® controller IP solutions and Samtec, a privately held $800MM global manufacturer of a broad line of electronic interconnect solutions, today announced a demo of their combined PCIe 4.0 solution that delivers full PCIe 4.0 bandwidth (16 GT/s) over copper or optical fiber at minimal cost.

The solution is based on a PLDA PCIe 4.0 acquisition board running PLDA’s PCIe 4.0 controller IP combined with Samtec’s FireFly™ Micro Flyover System™. This demo suggests a solution to overcoming the inherent limitations of maintaining PCIe 4.0 performance over long distances without changing the motherboard technology or using costly retimers.

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