1. Introduction
As silicon manufacturing process nodes keep shrinking and transistors get smaller, System-on-Chip (SoC) are increasingly subject to failures due to changing external conditions such as temperature, EMI, power surges, Hot Plug events, etc.
The transition to PCIe 4.0 and 5.0 with increasing PCIe signaling speeds (16GT/s and 32GT/s) also augments the risk of errors due to tightening timing budgets inside the SoC and electrical issues outside the SoC (e.g. crosstalk, line attenuation, jitter, etc.).